2017 HTC U Dual SIM Smartphone: May Arrive Shortly With IP57 Certification & Amazing Features

The HTC U with IP57 Certification will reportedly be presented in both single-SIM and dual-SIM forms, which is certainly moving to be welcome in unquestionable parts of the world. The HTC U will introduce with the Snapdragon chipset on board, at the 5.5-inch high-resolution touchscreen and a 12 MP digital camera.

According to Droidholic, the HTC U is supposed to launch by the end of this month. Another major attribute of the design is a fingerprint detection, which is used to unlock the phone in just 0.2 seconds.

While HTC has reduced the price on its latest Smartphone, the U (Ultra) has been obtaining more observation. The handsets will support against the elements with its IP57 Certification rating and will not provide 3.5mm headphone jack. As the HTC U (Ultra) does not have a 3.5mm port for your Smartphone, but its attractive much connects the direction HTC is moving with their mechanisms.

The HTC U (Ultra) will be one of the special entries to rise so far this year with its touch sensitive Edge Sensors which will permit a user to communicate with apps using the frame of the phone. The phone with IP57 Certification will also provide upgraded audio capture. The phone will run on Android 7.1 OS with HTC support specific skin on top, as per GSMArena.

The upgrading HTC U (Ultra) in the first issued images before a couple of hours and now some more data about the device has appeared. For fans of water protected Smartphone, the Smartphone will discover with IP57 Certification will be dust and water resisted. You cannot listen and charge at the same point of time and you can also simply harm your USB port while using your Smartphone.

The HTC U (Ultra) will come with the Snapdragon advance chipset with a 16 MP snapper and 4GB or 6GB of RAM. According to the modern development of the device, the Smartphone will convey an IP57 certification. That means customers will be able to immerse the Smartphone in water without any inflict physical harm to the device.