Intel’s New Kaby Lake-G Series Will Come in New Design Scheme: Multi-Die Design; Full Details
Intel is currently working on a new breed of processors that is based on the 14 nm manufacturing process, pretty known as the Kaby Lake-G Series. This new processor was said to be part of Intel's 7th Generation Core family; will be featuring a new hybrid design scheme.
According to WCCF Tech, a newly released Intel roadmap has confirmed that the US tech giant is now working on a new breed of Kaby Lake-G processor which was said to feature advanced technologies and new design scheme. Intel's next-gen Kaby Lake-G Series is to make multiple nodes for various parts of the processor and will reportedly come in 4C/8T with a new 65W and 100W model.
For the main core and GPU, Intel will use the current 14 nm processors including a dedicated PCI Express link to separate discrete GPU along with faster HBM2 memory. As for the new Kaby Lake-G Series, the company was said to be considering a multi-die design strategy; the CPU will be interconnected with other peripherals such as HBM2 memory using the flip-chip technology which is a known for interconnecting semiconductor devices.
According to Hot Hardware, Intel Company is no longer stranger when it comes to Multi-Die design from its Clarkdale family of microprocessors which managed to integrate a 32 nm CPU, memory controller into a single package, and a 45 nm GPU. The company will also likely to use Intel EMIB, also known as Embedded Multi-Die interconnect Bridge which the company stated that it is more efficient.
Intel's new multi-die strategy will ensure that good die-to-die interconnection is being maximized while maintaining a small die footprint and lower overall cost. In addition, the upcoming Intel Kaby Lake-G series will also feature the Ball Grid Array design and a package size of 58.5 x 31mm. The Kaby Lake G will also feature a package size of 58.5 x 32mm which is bigger than the desktop variant Kaby Lake S (37.5 x 37.5mm) and the laptop-focused Kaby Lake H (42 x 28mm).